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qtby?? sw??uk??b y the use of nickel(ni) as material for both the internal and external elec- trodes improves the solderability and heat resistance characteristics. this almost completely eliminates migration and raises the level of reliability significantly. y low equivalent series resistance(esr) provides excellent noise absorp- tion characteristics. y compared to tantalum or aluminum electrolytic capacitors these ceramic capacitors offer a number of excellent features, including: higher permissible ripple current values smaller case sizes relative to rated voltage improved reliability due to higher insulation resistance and break- down voltage. g0?
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??????? high value multilayer ceramic capacitors bj jmk316bj106ml _ t z k m 10 m m 20 z m y a4 j 6.3 l10 e16 t25 g35 u50 k plated q f y5v k 30 vj 85 c j 22 nk 82 l b j x7r k 55 vj 125 c m 15 l b j x5r k 55 vj 85 c m 15 l 80 20 1 rated voltage f vdc g 3 end termination 5 temperature characteristics code 7 capacitance tolerances flg k standard products 9 b bulk t tape & reel a 0.8 d 0.85 f 1.15 g 1.25 h 1.5 l 1.6 n 1.9 m 2.5 8 thickness f mm g 4 dimensions(case size) f mm g 10 11 packaging internal code 107 f 0603 g 1.6 p 0.8 212 f 0805 g 2.0 p 1.25 316 f 1206 g 3.2 p 1.6 325 f 1210 g 3.2 p 2.5 432 f 1812 g 4.5 p 3.2 550 f 2220 g 5.7 p 5.0 b o ? f >n? g t ???a?e?? 107 f 0603 g 1.6 p 0.8 212 f 0805 g 2.0 p 1.25 316 f 1206 g 3.2 p 1.6 325 f 1210 g 3.2 p 2.5 432 f 1812 g 4.5 p 3.2 550 f 2220 g 5.7 p 5.0 k m 10 % m m 20 % z m % a4 j 6.3 l10 e16 t25 g35 u50 k y?? ? q f m y b j m 10 30 80 80 20 1 ?y f vdc g 35 9s?
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??? 2 3??? ? 473 47,000 105 1,000,000 q a j ? qw ?? m multilayer ceramic capacitors 2 series name special code q standard products f bj x7r x5r f y5v k 25 vj 85 c k 55 vj 125 c k 55 vj 85 c k 25 vj 85 c k 30 vj 85 c operating temp. y general digital circuit y power supply bypass capacitors liquid crystal modules liquid crystal drive voltage lines ls i, i c, converters(both for input and output) y smoothing capacitors dc-dc converters (both for input and output) switching power supplies (secondary side) y ???s?
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q reliability data ?; w?? precautions ?3???? selection guide capacitors etc 4 h h 10 l max d amktype ; 212type hhh 9 l max d lmktype ; 212type, z; 316type f c w 10 a f g ? 316type f c w 4.7 a f g umktype ; 325type 16 l max d jmktype ; 107 n 212 n 316 n 325 n 432type lmktype ; 107 n 325 n 432, z; 316type f c x 10 a f g h some exceptions apply. refer to the available capacitance range table for the parts which are only available in x5r. hh 3.5 l max d lmktype ; 107type f c t 0.47 a f g , 212type f c t 1.0 a f g , 316 n 325 n 432 type emktype ; 107 n 212 n 316 n 325type tmktype ; 316type f c x 0.47 a f g , 325type, 432type gmktype ; 212type, 316type, 325type umktype ; 212type f c x 0.1 a f g , 316type f c u 0.47 a f g , 325type h h 5.0 l max d jmktype ; 107type, 212type, 316type, 325type, 432type, 550type lmktype ; 107type f c x 0.47 a f g , 212type f c u 2.2 a f g bj jis bj k 25 v 85 20 m 10 m 20 f m g 2.5%max.** eia x7r* k 55 v 125 25 m 15 m 10 f k g f jis f k 25 v 85 20 f z g 7.0%max.*** eia y5v k 30 v 85 25 9s c? hci temperature range , j9s hci ref. temp.
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q temperature characteristics j 30 k 80 j 22 k 82 j 80 k 20 j?f applicable standard ?? 1. m 0.2mm |)z? 2. m 0.15mm |)k? note: ? 1. including dimension tolerance m 0.2mm ( m 0.008inch). ? 2. inclulding dimension tolerance m 0.15mm ( m 0.006inch). ?t??3??y available capacitance range type f eia g lw t e g mk107 1.6 m 0.10 y 0.8 m 0.10 0.8 m 0.10 a 0.35 m 0.25 (0603) f 0.063 m 0.004 gf 0.031 m 0.004 gf 0.031 m 0.004 gf 0.014 m 0.010 g 0.85 m 0.10 d g mk212 2.0 m 0.10 1.25 m 0.10 f 0.033 m 0.004 g 0.5 m 0.25 (0805) f 0.079 m 0.004 gf 0.049 m 0.04 g 1.25 m 0.10 g f 0.020 m 0.010 g f 0.049 m 0.004 g 0.85 m 0.10 d f 0.033 m 0.004 g 1.15 m 0.10 f g mk316 3.2 m 0.15 1.6 m 0.15 f 0.045 m 0.004 g 0.5 0000 (1206) f 0.126 m 0.006 gf 0.063 m 0.006 g 1.25 m 0.10 g f 0.020 yy g f 0.049 m 0.004 g 1.6 m 0.20 l f 0.063 m 0.008 g 0.85 m 0.10 d f 0.033 m 0.004 g 1.15 m 0.10 f f 0.045 m 0.004 g g mk325 3.2 m 0.30 2.5 m 0.20 1.5 m 0.10 h 0.6 m 0.3 (1210) f 0.126 m 0.012 gf 0.098 m 0.008 gf 0.059 m 0.004 gf 0.024 m 0.012 g 1.9 m 0.20 n f 0.075 m 0.008 g 2.5 m 0.20 m f 0.098 m 0.008 g g mk432 4.5 m 0.40 3.2 m 0.30 2.5 m 0.20 m 0.9 m 0.6 (1812) f 0.177 m 0.016 gf 0.126 m 0.012 gf 0.098 m 0.008 gf 0.035 m 0.024 g g mk550 5.7 m 0.40 5.0 m 0.3 2.5 m 0.20 m 0.3 v 2.0 (2220) f 0.224 m 0.016 gf 0.197 m 0.012 gf 0.098 m 0.008 gf 0.012 v 0.079 g j 0.35 k 0.25 j 0.014 k 0.010 ? 1 ? 2 .com .com .com .com 4 .com u datasheet
40 tmk107bj223 g a emk107bj333 g a emk107bj473 g a emk107bj683 g a emk107bj104 g a lmk107bj154 g a lmk107bj224 g a lmk107bj334 g a lmk107bj474 g a lmk107bj684 g a jmk107bj105 g a emk107f224za emk107f474za lmk107f105za jmk107f225za m 10 l m 20 l m 20 l j 80 l k 20 l part numbers ??aa g please specify the capacitance tolerance code. w g tx
i?0??0)g?u???b{ 25v 16v 10v 6.3v 16v 10v 6.3v f 107type (0603 case size) 0.8 m 0.10 (0.031 m 0.004) m 10 l m 20 l j 80 l k 20 l 0.022 0.033 0.047 0.068 0.1 0.15 0.22 0.33 0.47 0.68 1.0 0.22 0.47 1.0 2.2 bj/x7r bj/x5r f/y5v ratedvoltage y ?yy g please specify the capacitance tolerance code. w g tx
i?0??0)g?u???b{ f 212type (0805 case size) 50v 35v 25v 16v 10v 6.3v 4v 50v 16v 10v 6.3v bj/x7r bj/x5r bj/x7r bj/x5r 0.022 0.033 0.047 0.068 0.1 0.15 0.22 0.33 0.047 0.068 0.15 0.22 0.33 0.47 0.68 1.0 0.68 1.0 2.2 3.3 4.7 10 0.22 0.47 1.0 1.0 2.2 4.7 10 0.85 m 0.1 (0.033 m 0.004) 1.25 m 0.1 (0.049 m 0.004) 0.85 m 0.1 (0.033 m 0.004) 1.25 m 0.1 (0.049 m 0.004) 1.25 m 0.15 (0.049 m 0.006) 1.25 m 0.20(0.049 m 0.008) 0.85 m 0.1(0.033 m 0.004) 1.25 m 0.1 (0.049 m 0.004) ratedvoltage temperature characteristics capacitance [ a f] capacitance tolerance thickness (inch) y ?yy yy? [mm]
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??????? y general multilayer ceramic capacitors 0.8 m 0.10 (0.031 m 0.004) tan dissipation factor [ l ]max. soldering method r: ??? reflow soldering w: ?? wave soldering ?
e 2.5 3.5 2.5 3.5 5 10 7 9 16 r,w r r,w r temperature characteristics capacitance [ a f] capacitance tolerance yy? [mm]
i?0? ?0) ?yy ?
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q tan dissipation factor [ l ]max. soldering method r: ??? reflow soldering w: ?? wave soldering ?
e thickness (inch) 2.5 3.5 5 7 16 r,w r r,w r ordering code yy umk212bj223 g d umk212bj333 g d umk212bj473 g g umk212bj683 g g umk212bj104 g g umk212bj154 g g gmk212bj224 g g gmk212bj334 g g tmk212bj473 g d tmk212bj683 g d emk212bj154 g g emk212bj224 g g emk212bj334 g g emk212bj474 g g emk212bj684 g g emk212bj105 g g lmk212b j684 g g lmk212b j105 g g lmk212bj225mg jmk212b j335mg jmk212b j475mg amk212bj106mg umk212f224zd umk212f474zg umk212f105zg emk212f105zg emk212f225zg lmk212f475zg jmk212f106zg ordering code yy f/y5v .com .com .com .com 4 .com u datasheet
capacitors 4 4 41 f 316type(1206 case size) 0.15 0.22 0.47 0.68 1.0 0.15 0.22 0.33 0.47 0.68 1.0 0.68 1.0 2.2 3.3 4.7 3.3 4.7 10 2.2 2.2 4.7 2.2 4.7 10 22 1.15 m 0.1 (0.045 m 0.004) 1.6 m 0.2 (0.063 m 0.008) 0.85 m 0.1 (0.033 m 0.004) 1.15 m 0.1 (0.045 m 0.004) 1.6 m 0.2 (0.063 m 0.008) 1.15 m 0.1 (0.045 m 0.004) 1.6 m 0.2 (0.063 m 0.008) 1.25 m 0.1 (0.049 m 0.004) 1.6 m 0.2 (0.063 m 0.008) part numbers ??aa j 80 l k 20 l f 325type(1210 case size) umk325bj105 g h gmk325bj155mn gmk325bj225mn tmk325bj335mn tmk325bj475mn emk325bj475mn emk325bj106mn lmk325bj106mn jmk325bj226mm umk325f475zh gmk325f106zh tmk325f106zh lmk325f226zn jmk325f476zn 1.0 1.5 2.2 3.3 4.7 4.7 10 10 22 4.7 10 10 22 47 m 20 l 50v 35v 25v 16v 10v 6.3v 50v 35v 25v 10v 6.3v ratedvoltage y ?yy umk316bj154 g f umk316bj224 g l umk316bj474 g l gmk316bj684 g l gmk316bj105 g l tmk316bj154 g d tmk316bj224 g f tmk316bj334 g f tmk316bj474 g l tmk316bj684 g l tmk316bj105 g l emk316bj684 g f emk316bj105 g f emk316bj225 ml emk316bj335ml emk316bj475ml lmk 316bj335 ml lmk 316bj475 ml jmk316bj106ml umk316f225zg gmk316f225zg gmk316f475zg tmk316f225zg tmk316f475zg lmk316f106zl lmk316f226zl f/y5v 50v 35v 25v 16v 10v 6.3v 50v 35v 25v 10v m 10 l m 20 l m 20 l j 80 l k 20 l 00 ratedvoltage y ?yy g please specify the capacitance tolerance code. w g tx
i?0??0)g?u???b{ m 10 lm 20 l g please specify the capacitance tolerance code. w g tx
i?0??0)g?u???b{ ordering code yy temperature characteristics capacitance [ a f] capacitance tolerance
i?0? ?0) ?yy ?
i?0? 9s?
q tan dissipation factor [ l ]max. soldering method r: ??? reflow soldering w: ?? wave soldering ?
e bj/x7r bj/x7r bj/x5r 2.5 3.5 2.5 3.5 5 7 9 16 r,w r r,w r r,w r ordering code yy temperature characteristics capacitance [ a f] capacitance tolerance
i?0? ?0) ?yy ?
i?0? 9s?
q tan dissipation factor [ l ]max. soldering method r: ??? reflow soldering w: ?? wave soldering ?
e bj/x7r bj/x5r bj/x7r bj/x5r bj/x7r bj/x5r bj/x7r bj/x5r f/y5v 3.5 5 9 7 16 r,w r r bj/x5r yy? [mm] thickness (inch) yy? [mm] thickness (inch) 1.5 m 0.1 (0.059 m 0.004) 1.9 m 0.2 (0.075 m 0.008) 2.5 m 0.2 (0.098 m 0.008) 1.5 m 0.1 (0.059 m 0.004) 1.9 m 0.2 (0.075 m 0.008) .com .com .com .com 4 .com u datasheet
42 part numbers ??aa j 80 l k 20 l f 432type(1812 case size) 10 22 47 47 100 m 20 l 2.5 m 0.2 (0.098 m 0.008) 2.5 m 0.2 (0.098 m 0.08) 25v 10v 6.3v 10v 6.3v ratedvoltage y ?yy yy temperature characteristics capacitance [ a f] capacitance tolerance
i?0? ?0) ?yy ?
i?0? 9s?
q tan dissipation factor [ l ]max. soldering method r: ??? reflow soldering w: ?? wave soldering ?
e bj/x5r f/y5v 3.5 5 16 r r tmk432bj106mm lmk432bj226mm jmk432bj476mm lmk432f476zm jmk432f107zm ordering code f 550type(2220 case size) 100 m 20 l 2.5 m 0.2 (0.098 m 0.008) 6.3v ratedvoltage y ?yy yy temperature characteristics capacitance [ a f] capacitance tolerance
i?0? ?0) ?yy ?
i?0? 9s?
q tan dissipation factor [ l ]max. soldering method r: ??? reflow soldering w: ?? wave soldering ?
e bj/x5r 5 r jmk550bj107mm ordering code yy? [mm] thickness (inch) yy? [mm] thickness (inch) .com .com .com .com 4 .com u datasheet
capacitors 4 4 43 part numbers ??aa ?
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??????? y low profile multilayer ceramic capacitors j 80 l k 20 l f 212type(0805 case size) 0.47 0.68 1.0 2.2 4.7 m 10 l m 20 l 0.85 m 0.1 (0.033 m 0.004) 0.85 m 0.1 (0.033 m 0.004) 16v 10v 10v 6.3v ratedvoltage y ?yy yy temperature characteristics capacitance [ a f] capacitance tolerance
i?0? ?0) ?yy ?
i?0? 9s?
q tan dissipation factor [ l ]max. soldering method r: ??? reflow soldering w: ?? wave soldering ?
e 3.5 9 16 r, w r r emk212bj474 ? d emk212bj684 ? d lmk212bj105 ? d lmk212f225zd jmk212f475zd ordering code j 80 l k 20 l f 316type(1206 case size) 2.2 3.3 3.3 4.7 6.8 4.7 10 10 m 20 l 0.85 m 0.1 (0.033 m 0.004) 1.15 m 0.1 (0.045 m 0.004) 0.85 m 0.1 (0.033 m 0.004) 1.15 m 0.1 (0.045 m 0.004) 0.85 m 0.1 (0.033 m 0.004) 1.15 m 0.1 (0.045 m 0.004) 0.85 m 0.1 (0.033 m 0.004) 10v 6.3v 10v 6.3v ratedvoltage y ?yy yy temperature characteristics capacitance [ a f] capacitance tolerance
i?0? ?0) ?yy ?
i?0? 9s?
q tan dissipation factor [ l ]max. soldering method r: ??? reflow soldering w: ?? wave soldering ?
e 3.5 5 9 16 r r lmk316bj225md lmk316bj335mf jmk316bj335md jmk316bj475md jmk316bj685mf lmk316f475zd lmk316f106zf jmk316f106zd ordering code j 80 l k 20 l f 325type(1210 case size) 3.3 4.7 10 10 10 22 m 20 l 0.85 m 0.1 (0.033 m 0.004) 1.15 m 0.1 (0.045 m 0.004) 0.85 m 0.1 (0.033 m 0.004) 1.15 m 0.1 (0.045 m 0.004) 10v 6.3v 16v 10v ratedvoltage y ?yy yy temperature characteristics capacitance [ a f] capacitance tolerance
i?0? ?0) ?yy ?
i?0? 9s?
q tan dissipation factor [ l ]max. soldering method r: ??? reflow soldering w: ?? wave soldering ?
e 3.5 5 7 16 r r lmk325bj335md lmk325bj475mf jmk325bj106mf jmk325bj106md emk325f106zf lmk325f226zf ordering code bj/x7r f/y5v bj/x7r bj/x5r f/y5v bj/x7r bj/x5r f/y5v w g tx
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81 capacitors 4 reliability data 1/3 item temperature compensating (class 1) standard specified value test methods and remarks high permitivity (class 2) high value standard note1 k 55 to j 125 c k 55 to j 125 c 50vdc,25vdc, 16vdc no breakdown or dam- age 10000 m e min. 0.5 to 5 pf: m 0.25 pf 1 to 10pf: m 0.5 pf 5 to 10 pf: m 1 pf 11 pf or over: m 5% m 10% 105typer q , s q , t q , u q only 0.5 ? 2pf : m 0.1pf 2.2 ? 20pf : m 5 % under 30 pf : q u 400 + 20c 30 pf or over : q u 1000 c= nominal capacitance ck d 0 m 250 cj d 0 m 120 ch d 0 m 60 cg d 0 m 30 pk d k 150 m 250 pj d k 150 m 120 ph d k 150 m 60 rk d k 220 m 250 rj d k 220 m 120 rh d k 220 m 60 sk d k 330 m 250 sj d k 330 m 120 sh d k 330 m 60 tk d k 470 m 250 tj d k 470 m 120 th d k 470 m 60 uk d k 750 m 250 uj d k 750 m 120 sl d +350 to -1000 (ppm/ c ) appearance: no abnormality capacitance change: within m 5% or m 0.5 pf, whichever is larger. b d k 55 to j 125 c f d k 25 to j 85 c b d k 55 to j 125 c f d k 25 to j 85 c 50vdc,25vdc k 25 to j 85 c k 25 to j 85 c 50vdc,35vdc,25vdc 16vdc,10vdc,6.3vdc 4dvc 16vdc no abnormality no breakdown or damage 500 m ea f. or 10000 m e ., whichever is the smaller. note 4 0.5 to 2 pf : m 0.1 pf 2.2 to 5.1 pf : m 5% refer to detailed speci- fication ch d 0 m 60 rh d k 220 m 60 f ppm/ cg appearance: no abnormality capacitance change: within m 0.5 pf appearance: no abnormality capacitance change: b, bj: within m 12.5% f: within m 30% b: m 10%, m 20% f d % b: 2.5% max. (50v, 25v) f: 5.0% max. (50v, 25v) y b d m 10 l fk 25 v 85 cg f d l fk 25 v 85 cg b f x7r g d m 15 l f f y5v g d yy l high frequency type 1.operating temperature range 2.storage temperature range 3.rated voltage 4.withstanding voltage between terminals 5.insulation resistance 6.capacitance (tolerance) 7. q or tangent of loss angle (tan d ) 8.temperature characteristic of capacitance 9.resistance to flexure of substrate (without voltage application) multilayer ceramic capacitor chips bj d m 10 l , m 20 l f d % bj: 2.5% max.(50v, 35v, 25v) y 3.5% max. f y 5.0% max. f y 10.0% max. f f: 7.0% max. y 5.0% max. f y 9.0% max. f y 11.0% max. f y 16.0% max. f y 20.0% max. f y f see table.1 bj d m 10 l fk 25 v 85 cg f d l fk 25 v 85 cg bj f x7r,x5r g d m 15 l f f y5v g d yy l j 80 k 20 j 80 k 20 j 30 k 80 j 30 k 80 y according to jis c 5102 clause 7.12. temperature compensating: measurement of capacitance at 20 c and 85 c shall be made to calculate temperature characteristic by the following equation. (c y - c y ) p 10 y (ppm/ c ) c y p q t y high permitivity: change of maximum capacitance deviation in step 1 to 5 temperature at step 1: +20 c temperature at step 2: minimum operating temperature temperature at step 3: +20 c (reference temperature) temperature at step 4: maximum operating temperature temperature at step 5: +20 c reference temperature for x7r, x5r and y5v shall be +25 c high capacitance type bj f x7r g d k 55 to j 125 c bj f x5r g d k 55 to j 85 c b f f y5v g d k 30 to j 85 c high capacitance type bj f x7r g d k 55 to j 125 c bj f x5r g d k 55 to j 85 c b f f y5v g d k 30 to j 85 c j 22 k 82 j 22 k 82 20 85 20 6 warp: 2mm testing board: paper-phenol substrate thickness: 1.6mm the measurement shall be made with board in the bent position. applied voltage: rated voltage p 3 (class 1) rated voltage p 2.5 (class 2) duration: 1 to 5 sec. charge/discharge current: 50ma max. (class 1,2) applied voltage: rated voltage duration: 60 m 5 sec. charge/discharge current: 50ma max. measuring frequency d class1 d 1 " hz m 10% f c t 1000pf g 1 : hz m 10% f c x 1000pf g class2 d 1 : hz m 10% f c t 22 a f g 120hz m 10hz f c x 22 a f g measuring voltage d class1 d 0.5 v 5vrms f c t 1000pf g 1 m 0.2vrms f c x 1000pf g class2 d 1 m 0.2vrms f c t 22 a f g 0.5 m 0.1vrms f c x 22 a f g bias application: none multilayer: measuring frequency d class1 d 1 " hz m 10% f c t 1000pf g 1 : hz m 10% f c x 1000pf g class2 d 1 : hz m 10% f c t 22 a f g 120hz m 10hz f c x 22 a f g measuring voltage d yyyyyy class1 d 0.5 v 5vrms f c t 1000pf g 1 m 0.2vrms f c x 1000pf g class2 d 1 m 0.2vrms f c t 22 a f g 0.5 m 0.1vrms f c x 22 a f g bias application: none high-frequency-multilayer: measuring frequency: 1ghz measuring equipment: hp4291a measuring jig: hp16192a .com .com .com .com 4 .com u datasheet
83 capacitors 4 reliability data 2/3 10.body strength 11.adhesion of electrode 12.solderability 13.resistance to soldering 14.thermal shock 15.damp heat (steady state) no mechanical dam- age. appearance: no abnor- mality capacitance change: within m 2.5% q: initial value insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 0.25pf q: initial value insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 0.5pf, insulation resistance: 1000 m e min. appearance: no abnormality capacitance change: within m 7.5% (b, bj) within m 20% (f) tan d : initial value insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnormality capacitance change: within m 7.5% (b, bj) within m 20% (f) tan d : initial value insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 2.5% or m 0.25pf, whichever is larger. q: initial value insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 2.5% or m 0.25pf, whichever is larger. q: initial value insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 5% or m 0.5pf, whichever is larger. q: c u 30 pf : q u 350 10 t c ? 30 pf: q u 275 + 2.5c c ? 10 pf : q u 200 + 10c c: nominal capacitance insulation resistance: 1000 m e min. no separation or indication of separation of electrode. at least 95% of terminal electrode is covered by new solder. appearance: no abnor- mality capacitance change: b: within m 12.5% f: within m 30% tan d : b: 5.0% max. f: 7.5% max. insulation resistance: 50 m ea f or 1000 m e whichever is smaller. appearance: no abnor- mality capacitance change: bj: within m 12.5% f: within m 30% tan d : bj: 5.0% max. 7.5% max. f 20.0% max. f f: 11.0% max. 7.5% max. f 16.0% max. f 19.5% max. f 25.0% max. f f see table.2 insulation resistance: 50 m ea f or 1000 m e whichever is smaller. high frequency multilayer: applied force: 5n duration: 10 sec. applied force: 5n duration: 30 m 5 sec. solder temperature: 230 m 5 c duration: 4 m 1 sec. preconditioning: thermal treatment (at 150 c for 1 hr) (applicable to class 2.) solder temperature: 270 m 5 c duration: 3 m 0.5 sec. preheating conditions: 80 to 100 c , 2 to 5 min. or 5 to 10 min. 150 to 200 c , 2 to 5 min. or 5 to 10 min. recovery: recovery for the following period under the stan- dard condition after the test. 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) preconditioning: thermal treatment (at 150 c for 1 hr) (applicable to class 2.) conditions for 1 cycle: step 1: minimum operating temperature 30 m 3 min. step 2: room temperature 15 min. step 3: maximum operating temperature 30 m 3 min. step 4: room temperature 15 min. number of cycles: 5 times recovery after the test: 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) item temperature compensating (class 1) standard test methods and remarks high permittivity (class 2) high value standard note1 high frequency type specified value multilayer d preconditioning: thermal treatment (at 150 c for 1 hr) (applicable to class 2.) temperature: 40 m 2 c humidity: 90 to 95% rh duration: 500 hrs recovery: recovery for the following period under the stan- dard condition after the removal from test chamber. 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) high-frequency multilayer: temperature: 60 m 2 c humidity: 90 to 95% rh duration: 500 hrs recovery: recovery for the following period under the stan- dard condition after the removal from test chamber. 24 m 2 hrs (class 1) multilayer ceramic capacitor chips +24 k 0 +24 k 0 .com .com .com .com 4 .com u datasheet
85 capacitors 4 reliability data 3/3 according to jis c 5102 clause 9. 9. multilayer: preconditioning: voltage treatment (class 2) temperature: 40 m 2 c humidity: 90 to 95% rh duration: 500 hrs applied voltage: rated voltage charge and discharge current: 50ma max. (class 1,2) recovery: recovery for the following period under the standard condition after the removal from test chamber. 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) high-frequency multilayer: temperature: 60 m 2 c humidity: 90 to 95% rh duration: 500 hrs applied voltage: rated voltage charge and discharge current: 50ma max. recovery: 24 m 2 hrs of recovery under the standard condi- tion after the removal from test chamber. according to jis c 5102 clause 9.10. multilayer: preconditioning: voltage treatment (class 2) temperature:125 m 3 cf class 1, class 2: b, bj f x7r gg 85 m 2 c (class 2: bj,f) duration: 1000 hrs applied voltage: rated voltage p 2 recovery: recovery for the following period under the stan- dard condition after the removal from test chamber. as for ni product, thermal treatment shall be performed prior to the recovery. 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) high-frequency multilayer: temperature: 125 m 3 c (class 1) duration: 1000 hrs applied voltage: rated voltage p 2 recovery: 24 m 2 hrs of recovery under the standard condi- tion after the removal from test chamber. 16.loading under damp heat 17.loading at high tempera- ture appearance: no abnor- mality capacitance change: c t 2 pf: within m 0.4 pf c x 2 pf: within m 0.75 pf c d nominal capaci- tance insulation resistance: 500 m e min. appearance: no abnor- mality capacitance change: within m 3% or m 0.3pf, whichever is larger. insulation resistance: 1000 m e min. appearance: no abnor- mality capacitance change: within m 7.5% or m 0.75pf, whichever is larger. q: c u 30 pf: q u 200 c ? 30 pf: q u 100 + 10c/3 c d nominal capaci- tance insulation resistance: 500 m e min. appearance: no abnor- mality capacitance change: within m 3% or m 0.3pf, whichever is larger. q: c u 30 pf : q u 350 10 t c ? 30 pf: q u 275 + 2.5c c ? 10 pf: q u 200 + 10c c d nominal capacitance insulation resistance: 1000 m e min. appearance: no abnor- mality capacitance change: bj: within m 12.5% (50v, 35v, 25v) within m 15.0% (16v and under) f: within m 30% tan d : bj: 5.0% max. 7.5% max. f 20.0% max. f f: 11.0% max. 7.5% max. f 16.0% max. f 19.5% max. f 25.0% max. f f see table.2 insulation resistance: 25 m ea f or 500 m e , whichever is the smaller. appearance: no abnormality capacitance change: bj: within m 12.5% f: within m 30% tan d : 5.0% max. 7.5% max. f 20.0% max. f f: 11.0% max. y 7.5% max. f y 16.0% max. f y 19.5% max. f y 25.0% max. f y f see table.2 insulation resistance: 50 m ea f or 1000 m e , which- ever is smaller. appearance: no abnor- mality capacitance change: b: within m 12.5% f: within m 30% tan d : b: 5.0% max. f: 7.5% max. insulation resistance: 25 m ea f or 500 m e , whichever is the smaller. appearance: no abnor- mality capacitance change: b: within m 12.5% f: within m 30% tan d : b: 4.0% max. f: 7.5% max. insulation resistance: 50 m ea f or 1000 m e , whichever is smaller. item temperature compensating (class 1) standard specified value test methods and remarks high permittivity (class 2) high value standard note1 high frequency type +24 k 0 +24 k 0 +48 k 0 note 1: for 105 type, specified in "high value". note 2: thermal treatment (multilayer): 1 hr of thermal treatment at 150 j 0 / k 10 c followed by 48 m 4 hrs of recovery under the standard condition shall be performed before the measurement. note 3: voltage treatment (multilayer): 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 4 8 m 4 hrs of recovery under the standard condition shall be performed before the measurement. +48 k 0 note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 c of temperature, 45 to 85% relative humidity, and 86 to 106kpa of air pressure. when there are questions concerning measurement results: in order to provide correlation data, the test shall be conducted unde r condition of 20 m 2 c of temperature, 65 to 70% relative humidity, and 86 to 106kpa of air pressure. unless otherwise specified, all the tests are conducted under the "standard condition." multilayer ceramic capacitor chips table. 1 y tan d (d. f.) table. 2 y tan d (d. f.) note 4: specified value for instration resistance of jmk212bj475m only: 100m ea f or more. item bj: lmk type; 063 type 105 type (c t 0.047 a f) 107 type (c t 0.47 a f) 212 type (c t 1 a f) 316 / 325 / 432 type emk type; 105 / 107/ 212 / 316 / 325 type tmk type; 316 type(c > 0.47 a f) 325 / 432 type gmk type;212 type (c u 0.22 a f) 316 type (c u 0.68 a f) 325 type umk type;212 type (c > 0.1 a f) 316 type (c u 0.47 a f) 325 type (c t 1 a f) bj: jmk type lmk type; 105 type (c u 0.056 a f) 107 type (c > 0.47 a f) 212 type (c > 1 a f) j4k, e4k type f: 105 type (50v, 25v) f: lmk type; 212 type 316 type ( c w 10 a f ) d z; ( c w 4.7 a f ) d ? 325 type (c > 10 a f) emk type; 105 type (c u 0.068 a f) umk type; 325 type (c u 4.7 a f) bj: amk type f: lmk type; 105 type (c w 0.22 a f) f: jmk type; 105 / 107 / 212 / 316 / 325 / 432 type lmk type; 107 type, 325 type 432 type,316 type (c > 10 a f) e4k type f: amk type tan d 3.5%max. 5.0% max. 9.0% max. 10.0% max. 11.0% max. 16.0% max. 20.0% max. item bj: jmk type lmk type; 063 type 105 type (c u 0.056 a f) 107 type (c u 0.47 a f) 212 type (c > 1 a f) j4k, e4k type f: 105 type(50v, 25v) f: lmk type; 105 type (c w 0.22 a f) f: jmk type; 105 / 107 / 212 / 316 / 325 / 432 type lmk type; 107 type 432 type e4k type bj: amk type f: amk type tan d 7.5% max. 16.0% max. 19.5% max. 20.0% max. 25.0% max. .com .com .com .com 4 .com u datasheet
78 ay packaging v w a z d g d d f g l f d f h n m 0.5 f 0.020 g 0.8 f 0.031 g 0.85 f 0.033 g 1.25 f 0.049 g 0.85 f 0.033 g 0.85 f 0.033 g 1.15 f 0.045 g 1.25 f 0.049 g 1.6 f 0.063 g 1.15 f 0.045 g 0.85 f 0.033 g 1.15 f 0.045 g 1.5 f 0.059 g 1.9 f 0.075 g 2.5 f 0.098 g g mk105 f 0402 g e vk105 f 0402 g g mk107 f 0603 g g mk212 f 0805 g g 4k212 f 0805 g g mk316 f 1206 g g 4k316 f 1206 g g mk325 f 1210 g a j
:? [ pcs ] 1 a j
:? standard quantity f >n?a bulk packaging y 2 a?e??py taping material 1000 mm f inch g code f a?e??ay taped packaging y a j
:? standard quantity [ pcs ]
a ?? thickness f eia g type p v w a z d g d d f g l f d f h n m m m 0.3 f 0.012 g 0.5 f 0.020 g 0.8 f 0.031 g 0.85 f 0.033 g 1.25 f 0.049 g 0.85 f 0.033 g 0.85 f 0.033 g 1.15 f 0.045 g 1.25 f 0.049 g 1.6 f 0.063 g 1.15 f 0.045 g 0.85 f 0.033 g 1.15 f 0.045 g 1.5 f 0.059 g 1.9 f 0.075 g 2.5 f 0.098 g 2.5 f 0.098 g 2.5 f 0.098 g g mk063 f 0201 g g mk105 f 0402 g e vk105 f 0402 g g mk107 f 0603 g g mk212 f 0805 g g 4k212 f 0805 g g mk316 f 1206 g g 4k316 f 1206 g g mk325 f 1210 g g mk432 f 1812 g g mk550 f 2220 g mm f inch g code
a ?? thickness f eia g type e e e e 3000 e e 3000 2000 2000 500 500 500 15000 10000 4000 4000 e 4000 4000 e e e e e e a j
:? standard quantity [ pcs ] a? paper ??a? embossed tape unit d mm f inch g 105, 107, 212 ypx0 ?`?bwpsemd<^m{ please contact any of our offices for accepting your requirement according to dimensions 0402, 0603, 0805.(inch) 3 ????y bulk cassette .com .com .com .com 4 .com u datasheet
79 capacitors 4 ay packaging 3 a?e??
goy taping dimensions y ya?y paper tape 8mm ? f 0.315inches wide g yyyyyyyyyyyyyyyyyyyy type ??
? ?
?e?? a?? f eia g chip cavity insertion pitch tape thickness abft g mk063 f 0201 g 0.37 m 0.06 5 0.67 m 0.06 55 2.0 m 0.05 0.42 m 0.02 f 0.06 m 0.002 gf 0.027 m 0.002 gf 0.079 m 0.002 gf 0.017 m 0.001 g g mk105 f 0402 g 0.65 m 0.1 5 1.15 m 0.1 55 2.0 m 0.05 0.8max. vk105 f 0402 g f 0.026 m 0.004 gf 0.045 m 0.004 gf 0.079 m 0.002 gf 0.031max. g g mk107 f 0603 g 1.0 m 0.2 1.8 m 0.2 f 0.039 m 0.008 gf 0.071 m 0.008 g g mk212 f 0805 g 1.65 m 0.2 5 2.4 m 0.2 4.0 m 0.1 1.1max. g 4k212 f 0805 g f 0.065 m 0.008 gf 0.094 m 0.008 gf 0.157 m 0.004 gf 0.043max. g g mk316 f 1206 g 2.0 m 0.2 3.6 m 0.2 f 0.079 m 0.008 gf 0.142 m 0.008 g unit d mm f inch g unit d mm f inch g type ??
? ?
?e?? a?? f eia g chip cavity insertion pitch tape thickness abfkt 3.7 m 0.2 4.9 m 0.2 8.0 m 0.1 0.6max. g mk432 f 1812 g f 0.146 m 0.008 gf 0.193 m 0.008 gf 0.315 m 0.004 g 3.4max. f 0.024max. g f 0.134max. g g mk550 f 2220 g 5.4 m 0.2 6.1 m 0.2 8.0 m 0.1 3.5max. 0.6max. f 0.213 m 0.008 gf 0.240 m 0.008 gf 0.315 m 0.004 g f 0.138max. gf 0.024max. g y??a?y embossed tape 8mm ? f 0.315inches wide g unit d mm f inch g 4 ??? ?? ?y leader and blank portion y 5 ???
goy reel size y 6 ??a?sy top tape strength y ??a?wxu`?x<
$1m2to 0.1 ? 0.7n qs??b{ the top tape requires a peel-off force of 0.1 v 0.7n in the direction of the arrow as illustrated below. ??a?y embossed tape 12mm ? f 0.472inches wide g type ??
? ?
?e?? a?? f eia g chip cavity insertion pitch tape thickness abfkt g mk212 f 0805 g 1.65 m 0.2 5 2.4 m 0.2 f 0.065 m 0.008 gf 0.094 m 0.008 g g mk316 f 1206 g 2.0 m 0.2 3.6 m 0.2 4.0 m 0.1 2.5max. 0.6max g 4k316 f 1206 g f 0.079 m 0.008 gf 0.142 m 0.008 gf 0.157 m 0.004 g f 0.098max. gf 0.024max. g g mk325 f 1210 g 2.8 m 0.2 3.6 m 0.2 3.4max. f 0.110 m 0.008 gf 0.142 m 0.008 g f 0.134max. g capacitors .com .com .com .com 4 .com u datasheet
87 precautions capacitors 4 1/6 technical considerations stages precautions precautions on the use of multilayer ceramic capacitors 1.circuit design verification of operating environment, electrical rating and per- formance 1. a malfunction in medical equipment, spacecraft, nuclear re- actors, etc. may cause serious harm to human life or have severe social ramifications. as such, any capacitors to be used in such equipment may require higher safety and/or reli- ability considerations and should be clearly differentiated from components used in general purpose applications. operating voltage (verification of rated voltage) 1. the operating voltage for capacitors must always be lower than their rated values. if an ac voltage is loaded on a dc voltage, the sum of the two peak voltages should be lower than the rated value of the ca- pacitor chosen. for a circuit where both an ac and a pulse voltage may be present, the sum of their peak voltages should also be lower than the capacitor's rated voltage. 2. even if the applied voltage is lower than the rated value, the reliability of capacitors might be reduced if either a high fre- quency ac voltage or a pulse voltage having rapid rise time is present in the circuit. 1.the following diagrams and tables show some examples of recommended patterns to prevent excessive solder amourts. f larger fillets which extend above the component end terminations g examples of improper pattern designs are also shown. (1) recommended land dimensions for a typical chip capacitor land patterns for pcbs 2.pcb design pattern configurations (design of land-patterns) 1. when capacitors are mounted on a pcb, the amount of sol- der used (size of fillet) can directly affect capacitor performance. therefore, the following items must be carefully considered in the design of solder land patterns: (1) the amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to break- ing or cracking. therefore, when designing land-patterns it is necessary to consider the appropriate size and con- figuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. (2) when more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-re- sist. recommended land dimensions for wave-soldering (unit: mm) recommended land dimensions for reflow-soldering (unit: mm) type 107 212 316 325 1.6 2.0 3.2 3.2 0.8 5 1.25 1.6 2.5 a 0.8 v 1.0 1.0 v 1.4 1.8 v 2.5 1.8 v 2.5 b 0.5 v 0.8 0.8 v 1.5 0.8 v 1.7 0.8 v 1.7 c 0.6 v 0.8 0.9 v 1.2 1.2 v 1.6 1.8 v 2.5 l w size excess solder can affect the ability of chips to withstand mechanical stresses. therefore, please take proper precautions when designing land-patterns. size l w type 063 105 107 212 316 325 432 550 0.6 1.0 1.6 2.0 3.2 3.2 4.5 5.7 0.3 0.5 0.8 5 1.25 1.6 2.5 3.2 5.0 a 0.20 v 0.30 0.45 v 0.55 0.6 v 0.8 0.8 v 1.2 1.8 v 2.5 1.8 v 2.5 2.5 v 3.5 3.7 v 4.7 b 0.20 v 0.30 0.40 v 0.50 0.6 v 0.8 0.8 v 1.2 1.0 v 1.5 1.0 v 1.5 1.5 v 1.8 1.5 v 2.3 c 0.25 v 0.40 0.45 v 0.55 0.6 v 0.8 0.9 v 1.6 1.2 v 2.0 1.8 v 3.2 2.3 v 3.5 3.5 v 5.5 size type 316 4 circuits 212 4 circuits 3.2 2.0 1.6 1.25 a 0.7 v 0.9 0.5 v 0.6 b 1 0.5 v 0.6 c 0.4 v 0.5 0.2 v 0.3 d 0.8 0.5 l w .com .com .com .com 4 .com u datasheet
89 precautions capacitors 4 2/6 (2) examples of good and bad solder application 2.pcb design 1-1. the following are examples of good and bad capacitor layout; smd capacitors should be located to minimize any possible mechanical stresses from board warp or deflection. not recommended recommended deflection of the board pattern configurations (capacitor layout on panelized [breakaway] pc boards) 1. after capacitors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufac- turing processes (pcb cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.) for this reason, planning pattern configurations and the position of smd capacitors should be carefully performed to minimize stress. items component placement close to the chassis not recommended recommended 1-2. to layout the capacitors for the breakaway pc board, it should be noted that the amount of mechanical stresses given will vary depending on capacitor layout. the example below shows recommendations for better design. 1-3. when breaking pc boards along their perforations, the amount of mechanical stress on the capacitors can vary according to the method used. the following methods are listed in order from least stressful to most stressful: push-back, slit, v-grooving, and perfora- tion. thus, any ideal smd capacitor layout must also consider the pcb splitting proce- dure. technical considerations stages precautions mixed mounting of smd and leaded components hand-soldering of leaded components near mounted components horizontal component placement precautions on the use of multilayer ceramic capacitors .com .com .com .com 4 .com u datasheet
91 precautions capacitors 4 3/6 3.considerations for auto- matic placement adjustment of mounting machine 1. excessive impact load should not be imposed on the capaci- tors when mounting onto the pc boards. 2. the maintenance and inspection of the mounters should be conducted periodically. technical considerations stages precautions 1. if the lower limit of the pick-up nozzle is low, too much force may be imposed on the capacitors, causing damage. to avoid this, the following points should be considered before lowering the pick-up nozzle: (1)the lower limit of the pick-up nozzle should be adjusted to the surface level of the pc board after correcting for deflection of the board. (2)the pick-up pressure should be adjusted between 1 and 3 n static loads. (3)to reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the pc board. the following dia- grams show some typical examples of good pick-up nozzle placement: not recommended recommended single-sided mounting double-sided mounting 2. as the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the capacitors because of mechanical impact on the capacitors. to avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. 1. some adhesives may cause reduced insulation resistance. the difference between the shrinkage percentage of the adhesive and that of the capacitors may result in stresses on the capacitors and lead to cracking. moreover, too little or too much adhesive applied to the board may adversely affect component placement, so the following precautions should be noted in the application of adhesives. (1)required adhesive characteristics a. the adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. the adhesive should have sufficient strength at high temperatures. c. the adhesive should have good coating and thickness consistency. d. the adhesive should be used during its prescribed shelf life. e. the adhesive should harden rapidly f. the adhesive must not be contaminated. g. the adhesive should have excellent insulation characteristics. h. the adhesive should not be toxic and have no emission of toxic gasses. (2)the recommended amount of adhesives is as follows; figure 212/316 case sizes as examples a 0.3mm min b 100 v 120 a m c adhesives should not contact the pad selection of adhesives 1. mounting capacitors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded capacitor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. there- fore, it is imperative to consult the manufacturer of the adhe- sives on proper usage and amounts of adhesive to use. precautions on the use of multilayer ceramic capacitors .com .com .com .com 4 .com u datasheet
93 precautions capacitors 4 4/6 4. soldering selection of flux 1. since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; (1)flux used should be with less than or equal to 0.1 wt% (equivelent to chroline) of halogenated content. flux hav- ing a strong acidity content should not be applied. (2)when soldering capacitors on the board, the amount of flux applied should be controlled at the optimum level. (3)when using water-soluble flux, special care should be taken to properly clean the boards. soldering temperature, time, amount of solder, etc. are specified in accor- dance with the following recommended conditions. 1-1. when too much halogenated substance (chlorine, etc.) content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the capacitors. 1-2. flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. to mini- mize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of capacitors in high humidity conditions may cause a degrada- tion of insulation resistance and therefore affect the reliability of the components. the cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. 1-1. preheating when soldering heating: ceramic chip components should be preheated to within 100 to 130 c of the sol- dering. cooling: the temperature difference between the components and cleaning process should not be greater than 100 c . ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concen- trated heating or rapid cooling. therefore, the soldering process must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock. technical considerations stages precautions recommended conditions for soldering [reflow soldering] temperature profile caution 1. the ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the thick- ness of the capacitor, as shown below: 2. because excessive dwell times can detrimentally affect solderability, soldering dura- tion should be kept as close to recommended times as possible. [wave soldering] temperature profile caution 1. make sure the capacitors are preheated sufficiently. 2. the temperature difference between the capacitor and melted solder should not be greater than 100 to130 c 3. cooling after soldering should be as gradual as possible. 4. wave soldering must not be applied to the capacitors designated as for reflow solder- ing only. precautions on the use of multilayer ceramic capacitors .com .com .com .com 4 .com u datasheet
95 precautions capacitors 4 5/6 caution 1. use a 20w soldering iron with a maximum tip diameter of 1.0 mm. 2. the soldering iron should not directly touch the capacitor. [hand soldering] y temperature profile 5.cleaning cleaning conditions 1. when cleaning the pc board after the capacitors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of the cleaning (e.g. to remove soldering flux or other materials from the production process.) 2. cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the capacitor's characteristics. 1. the use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a degra- dation of the capacitor's electrical properties (especially insulation resistance). 2. inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimentally affect the performance of the capacitors. (1)excessive cleaning in the case of ultrasonic cleaning, too much power output can cause excessive vibration of the pc board which may lead to the cracking of the capacitor or the soldered portion, or decrease the terminal electrodes' strength. thus the following conditions should be carefully checked; ultrasonic output below 20 w/ b ultrasonic frequency below 40 khz ultrasonic washing period 5 min. or less 4. soldering 6.post cleaning processes 1. with some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the harden- ing period or while left under normal storage conditions result- ing in the deterioration of the capacitor's performance. 2. when a resin's hardening temperature is higher than the capacitor's operating temperature, the stresses generated by the excess heat may lead to capacitor damage or destruction. the use of such resins, molding materials etc. is not recom- mended. breakaway pc boards (splitting along perforations) 1. when splitting the pc board after mounting capacitors and other components, care is required so as not to give any stresses of deflection or twisting to the board. 2. board separation should not be done manually, but by using the appropriate devices. mechanical considerations 1. be careful not to subject the capacitors to excessive mechani- cal shocks. (1)if ceramic capacitors are dropped onto the floor or a hard surface, they should not be used. (2)when handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. 7.handling technical considerations stages precautions precautions on the use of multilayer ceramic capacitors .com .com .com .com 4 .com u datasheet
97 precautions capacitors 4 6/6 8.storage conditions storage 1. to maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. hu- midity should especially be kept as low as possible. y recommended conditions ambient temperature below 40 c humidity below 70% rh the ambient temperature must be kept below 30 c . even un- der ideal storage conditions capacitor electrode solderability decreases as time passes, so ceramic chip capacitors should be used within 6 months from the time of delivery. y the packaging material should be kept where no chlorine or sulfur exists in the air. 2. the capacitance value of high dielectric constant capacitors (type 2 &3) will gradually decrease with the passage of time, so this should be taken into consideration in the circuit design. if such a capacitance reduction occurs, a heat treatment of 150 c for 1hour will return the capacitance to its initial level. 1. if the parts are stored in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. for this reason, components should be used within 6 months from the time of delivery. if exceeding the above period, please check solderability before using the capacitors. technical considerations stages precautions precautions on the use of multilayer ceramic capacitors .com .com .com 4 .com u datasheet

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